Product describe

1,Infrared ray disassemble sodering technique;
2, professional the infrared ray heat and wear deeply dint is strong, the spare part be subjected to hot even;
3, Operation easy, just learn it one day you can operate this machine ;
4, Dont need disassemble sodering other equipment, this machine can disassemble sodering 35-50 mms all components.
5, This machine provide 800W to prepare heat to dissolve gum system and provide hot scope 240 x180 mm.
6, Infrared ray heat no need hot romantic move, will not influence a peripheral small component, it can disassemble soderingor and return to fix BGA, SMD, CSP, LGA, QFP, PLCC and make BGA solder ball,important is a BGA, SMD component.and it can fix Scokt and slot .( CPU socket and GAP slot);
7, It can satisfy a computer, notebook, game machine etc. the BGA disassemble sodering/exchange .important for computer south or north bridge.